Job Description:
Reporting directly to the COO, the position will lead a team of 30 engineers and professionals in HK, PRC and *** to deliver excellent quality management service in 4 main functional areas.

1. Quality Assurance
（1）Establish and monitor quality management systems & programs for product quality, manufacturing quality, customer quality & supplier quality.
（2）Manage customer incident case and fulfill customer audit.
（3）Ensure quality and manufacturing operations meet regulated standards and maintain accreditation status for ISO9001 & ISO14001.

2. Fab Operations
（1）Manage wafer capacity allocation.
（2）Implement cost control measures including CP yield improvement and wafer price negotiation.
（3）Source fab technology node for NPI.

3. Backend
（1）Manage backend capacity planning and allocation.
（2）Implement cost control measures including Assembly yield improvement and backend price negotiation.
（3）Source assembly package for NPI.

4. Test Development
（1）Source and manage test platform for NPI & MP.
（2）Implement cost control measure by test time reduction.


Job Requirements:
1. Bachelor / Master in Engineering or equivalent;
2. Minimum 15 years of working experience in semiconductor manufacturing industry with display driver IC experience preferred;
3. Professional knowledge of semiconductor manufacturing system;
4. Experience with NPI processes involved in fabless semiconductor company;
5. Strong ability to work with regional and headquarter team for results;
6. Effective communication, presentation and interpersonal skills;
7. Fluent oral and written English.
8. Work location: Nanjing or Shenzhen.

职位描述：
该职位直接向首席运营官汇报，将领导一支由 30 名来自中国香港、中国大陆和中国台湾的工程师及专业人士组成的团队，在以下4个主要职能领域提供优秀的质量管理服务:

1、品质管理
(1) 建立和监控产品质量、制造质量、客户质量和供应商质量的质量管理体系和程序；
(2)管理客户冲突事件并完成客户审核；
(3) 确保质量和生产运作符合规定标准，并保持ISO9001和ISO14001认证处于有效状态。

2、晶圆厂运营
(1)管理晶圆产能分配；
(2)实施成本控制措施，包括CP良率改善和晶圆价格谈判；
(3)挖掘新产品导入(NPI) 的晶圆厂技术节点。

3、后端生产管理
(1) 管理后端工厂产能计划和分配；
(2)实施成本控制措施，包括提高装配良率和后端价格谈判；
(3)找寻优质的新产品导入装配包。

4、测试开发
(1)为新产品导入及量产寻找并管理测试平台；
(2)通过减少测试时间来实施成本控制措施。

职位要求:
1. 工程学本科/硕士或相关专业；
2. 15年以上半导体制造行业工作经验，有显示驱动IC经验者优先；
3. 具备半导体制造系统专业知识；
4. 具备无晶圆厂半导体公司新产品导入工艺经验；
5. 有较强的与区域和总部团队合作并取得成果的能力；
6. 具备有效的沟通、表达和人际交往能力；
7. 英语说写流利。
8. 工作地点:南京或深圳。