In your new role you will:
61Manage package development execution within product/technology development according to project milestone, quality & cost requirements. Project complexity could be from Class E up to Class C.
61Aligned with chip/system development, test engineering for all technical, cost and quality aspects during project phase.
61Support Package Definition group to ensure package platform complexity, product requirement, customer commitment are met.
61Problem solving and trouble shooting of development issues.
61Responsible for samples, qualification build-up & transfer into manufacturing engineering.
61Communication channel of dedicated project in BE to requestor (e.g. Project Owner, PJM of Product Line, Package group PCK of Product Line, BE Management, Steering committee).
61Responsible for regular KLUSA reporting and milestone release in NPI Tool
61Reporting project progress to Project Owner / PJM of PL and/or development board in BE OSAT

You are best equipped for this task if you have:
61Masters/Bachelor’s Degree in Engineering and Physical Science.
61At least 5 years above of relevant working experience and thereof 4years of leading projects
61Experience in semiconductor R&D in packaging group and managing project
61Has very good project management knowledge in terms of project initiation, planning and closing including reporting and documentation
61Analytical mind and high initiative to challenge him/herself and the team to move the next level of competency.
61Experience in analytical tool, e.g. Surface analysis, material character isation, DoE, D/PFMEA, 8D and simulation knowledge will be an added advantage
61IP management, e.g. patent filing.
61Certification on PMP, IPMA C, 6SIGMA are value added