Job Responsibilities
1. Responsible for Assembly & Packaging development, qualification，package design, design verification and simulations.
2. Ensure project management following PD phase gate，ensure new package design following design flow.
3. Lead design new packaging methodologies to meet business/customer requirements.
4. Lead develop the equipment technology along with the package roadmap.
5. Lead research the packaging materials, responsible for characterization, application and selection.
6. Responsible for Substrate, Lid & stiffener& cover spec management.
7. Lead communicate with customers, suppliers to define development activities and technology compared with other OSATs.
8. Drive and work with Assembly Engineering and suppliers for yield improvement during NPI stage.
9. Lead key projects of R&D team.
10. Support critical customer issues, including investigation, experiment, simulations, etc.
11. Lead junior engineer and train the basic skill, knowledge.
12. Other duties as assigned by supervisor.
13. Responsible for design for manufacturing (DFM) for the success of customer products.
14. Lead QTR/QBR with customer and supplier.
15. Development of package and technology roadmap that meet future business/customer requirements and increase the organization’s competitive position.
16. Design new packaging methodologies to meet business/customer requirements.
17. Creative thinking and actions on new IP, new package and technology idea generation.
Job Qualifications
- Education: Bachelor Degree or above in electrical, mechanical, thermal engineering or equivalent
- Language: Excellent oral and written skills in English or Mandarin
- Experience: >5 years’ work experience including 2~3 years’ semiconductor