1.University graduated in Electrical/mechanical Engineering.
2.About 5-7 years working experience in die bond related area is perfect, this year''s graduates also can accept.
3:Comprehensive process and basic equipment knowledge on related area.
4:Familiar with QFN/TSOP/BGA/MCP/wBGA process.
5.Good communication /interpersonal /negotiation skills
6.Advanced process control knowledge(SPC, QCC, FMEA, DOE, problem solving)
7.Project and presentation skill
1.Be responsible for die attach process new product phase in related issue, and process development.
2.Generate process spec, sop and training material as needed, support engineering to maintain quality system.
3.Conduct new process development to support new package/process qualification.
4.Take initiative to conduct process improvement, cost reduction project.
5.Communicate internally and externally, lead multi-functional team to achieve process goals.
6.Able to come out professional technical report on related operation.