1. Responsible for power module assemblyend of line(EOL) process such like Plasma clean, adhesion promoter coating, trim/form and packing to develop power module for industrial and automotive application.
2. Optimize assembly EOL process, material and machine parameters to achieve required reliability, quality and DFM.
3. Responsible to resolve resolutions against technical problem in EOL, failure from reliability and customer application.
4. Responsible customer and RnD purpose samples build in the line and machine parameters and process optimization.
5. Responsible to generate RnD samples control plan, PFMEA and key member to generate DFMEA.
6. Responsible to select material like EMC, Tube, Tappe and reel, MBB packing and tools.
7. Generate engineering report about RnD activities for EOL process.
专业要求
1. Min Bachelor from major in science or engineering.
2. Master will get advantages.
3. Min 3 years engineering careers in semiconductor assembly and test engineering.
专业技能
1. Understand mold, trim/form. plating and deflash and JEDEC reliability
2. Able to set up mold parameters and optimize epoxy mold compound
3. understanding AQPP, DFMEA, Statistical analysis.
其他要求
Able to travel to ChangShu plant when there are activities in plant. Around 70% of working days working in ChangShu plant.