1. Responsible for power module assembly front of line(FOL) process such like Saw, SMT, reflow, Al wire bonding, Sintering to develop power module for industrial and automotive application
2. Optimize assembly FOL process, material and machine parameters to achieve required reliability, quality and DFM
3. Responsible to resolve resolutions against technical problem in FOL, failure from reliability and customer application
4. Responsible customer and RnD purpose samples build in the line and machine parameters and process optimization
5. Responsible to generate RnD samples control plan, PFMEA and key member to generate DFMEA
6. Responsible to select material like reflow solder, preform, sinter material, Al wires jigs and tools
7. Generate engineering report about RnD activities for FOL process.
专业要求
1. Min Bachelor from major in science or engineering
2. Master will get advantages
3. Min 3 years engineering careers in semiconductor assembly and test engineering
专业技能
1. Understand SMT, reflow, wire bond machine and its parameters
2. Able to set up Al wire bonder
3. understanding AQPP, DFMEA, Statistical analysis
工作年限
Min 3 years career in semiconductor FOL assembly
其他要求
Able to travel to ChangShu plant when there are activities in plant. Around 70% of working days working in ChangShu plant.