工作职责:
1. Die Attach Process Development;
2.Quality Assurance;
3.Process Documentation;
4.Cross-Functional Collaboration;
5.Continuous Improvement.
任职资格:
1. Education:*Bachelor;s degree in Electrical Engineering, Mechanical Engineering, Materials Science.
2.Experience:
2.1 3+ years of experience in semiconductor assembly, specifically in die attach processes.
2.2 Hands-on experience with die attach equipment and tools.
3.Soft Skills/others:
3.1 Able to communicate in English, Malay and Mandarin.