Responsibility
◇ 负责新封装结构的设计和工艺流程//设备，制定相应技术规范；
New package design and process flow control/equipment, design rule update;
◇ 评审客户产品规格及相关图纸；
Customer spec and drawing review;
◇ 绘制相关工程图纸并做档案管理；
Engineering drawing and file management;
◇ 配合其他部门进行封装工艺完善和改进；
Cooperation with engineering or manufacture team for improvement;
◇ 了解市场动态，研究适应市场发展的新封装产品。
Package market survey and study.

岗位要求
Job Requirements
教育背景
Education Background
◇ 大学本科或硕士以上学历，半导体器件物理、机械设计、材料及相关专业。
Bachelor or above, major in Semiconductor, Mechanical Design, Material or related.
工作经验
Working Experience
◇ 5年以上半导体封装行业经验。
Over 5 years semiconductor experience.