工作职责:
Technology/Process Development:
1. New FAB technologies related package solution and verification.
2. Drive Package technologies (Die bond, Wire bond), engineering and MP activities (yield,quality)
3. Coordinate activities and drive results with RW/LPA teams.
任职资格:
1. Assembly experience over 5 years (especially for CMOS, Logic. )
2. Automotive requirement understanding (ex. AEC-Q100, board level reliability...etc)
3. Module experience over 3 years
4. Process integration skill
5. Statistics analysis skill (ex. JMP, Minitab...etc)
6. Communication skill (English & Chinese)