一、职位概述 Job Summary
1、对产品特性及工艺优化进行研究确定加工能力以满足客户需求。
Conduct research on product characteristics and process optimization to determine processing capabilities to meet customer needs.
2、按照标准作业流程和作业指导书进行技术导入并确保技术的可靠性和稳定性。
Follow standard operating procedures and work instructions to introduce technology and ensure its reliability and stability.
3、调查并汇报生产工艺相关的问题，并查明问题根源。
Investigate and report production process related issues, and identify the root cause of the problem.
4、推动质量、良率提升和成本改善等项目的执行。
Drive the execution of projects such as quality, yield improvement, and cost improvement.
5、与工程部及其他部门合作进行问题处理和产品革新。
Collaborate with the engineering department and other departments to handle issues and innovate products.
6、与内外部设备厂商或其他装配部门合作提升和发展目前的生产工艺。
Collaborate with internal and external equipment manufacturers or other assembly departments to enhance and develop current production processes.
7、确定引进新设备，审核和批准设备的设计和工序。
Determine the introduction of new equipment, review and approve the design and process of the equipment.
8、负责设备运抵工厂前负责进行设备验收实验。.
Responsible for conducting equipment acceptance tests before the equipment arrives at the factory.
9、撰写工艺确认报告并进行安装、操作性能认证。
Write a process confirmation report and conduct installation and operational performance certification.
10、分析制造工艺，持续改进以达成质量﹑产量及成本目标。
Analyze manufacturing processes and continuously improve to achieve quality, output, and cost goals.

二、职条件 Job Requirements
1） 电子、微电子、电气、光点等相关专业本科毕业；
Bachelor's degree in electronics, microelectronics, electrical, photoelectricity and other related fields.
2） 5年以上半导体前道工艺相关经验，熟悉光刻工艺，了解半导体器件工艺；
More than 5 years of experience in semiconductor front-end processes, familiar with photo processes , familiar with semiconductor device processes
3） 具备英语阅读和写作能力；
Ability to read and write in English.
4） 具有学习、沟通、协调、执行和分析解决问题及团队协作能力。
Having the ability to learn, communicate, coordinate, execute, analyze and solve problems, as well as teamwork skills.