岗位职责：
61 Process Technology Development:
89 Develop, qualify, and optimize Solder Ball Attach (SBA) processes (e.g., ball placement, reflow, flux cleaning…) for advanced packaging (e.g., BGA, CSP, WLCSP, HBM, HBF…)
89 Investigate new solder materials (e.g., lead-free alloys, low-temperature solders) and processes to improve joint reliability and thermal performance.
89 Collaborate with material suppliers and equipment vendors to evaluate next-generation solutions (e.g., micro-bumping, laser-assisted bonding).
61 Module Excellence:
89 Resolve critical technical challenges & address critical defects (ball missing, ball damage, bridging, voids…) by using innovation & breakthrough ideas.
89 Drive optimization of process flows, parameter, material, and DFM enhancements.
89 Conduct DOE (Design of Experiments) to refine process parameters (temperature profiles, ball size, alignment accuracy…) for high process capability & high product performance.
61 New Process/Product Introduction:
89 Lead new process setup and oversee technical reviews during NPI phases to ensure rapid ramp-up to high-volume production.
89 Phase review management to ensure new product/process on schedule delivery.
89 Contribute to advanced packaging roadmaps (e.g., thinner dies, higher die counts, 3D NAND integration, HBM, HBF…).
岗位要求：
教育背景Education
Master’s degree in Electrical Engineering, Material Science, Mechanical Design Engineering, Physics and
Chemistry Engineering, or other simi-conductor related field.

知识Knowledge
*职位要求的信息或知识范围 Statement of the Informational or conceptual framework required by the Job
61 Be familiar with the process flow of NAND packaging, including but not limited to the process requirements and machine settings of Solder Ball Attach Related.
61 Demonstrated proficiency in utilizing diverse quality management methodologies and advanced data analysis software solutions.
61 Candidates with semiconductor fabrication (Fab) or advanced packaging experience are strongly preferred, with demonstrated understanding of key advanced packaging technologies including TSV, TC-NCF, MR-MUF, micro bumping and interposer.
61 Preference will be given to applicants with hands-on experience in HBM and HBF technologies.

相关工作经验Experiences
61 3+ years of experience in semiconductor assembly process/product engineering or other related.
61 Strong knowledge of assembly processes (especially on solder ball attach related).
61 Experience in new product or process technology development is a plus.
其他胜任力Competencies & Soft Skill
61 MDI - Mindset of Disruptive Innovation
61 Good English skill, both written and oral
61 Strong self-learning motivation, and excellent communication and teamwork skills.
61 Knowledge of Lean Manufacturing/Six Sigma is a plus.
61 Experience in automation/intelligent manufacturing is a plus.