岗位职责：
1.Applying DB process expertise and technology to make process management to fulfill quality, cost, yield, capacity, delivery requirement运用装片工艺专业知识和技术进行过程管理，以满足质量、成本、良率、产能和交货要求
2.Make advanced data analysis, DOE study of DB process parameters to ensure DB process control in excellent condition 对装片工艺参数进行先进的数据分析和DOE研究，确保装片工艺控制处于***状态
3.New DB process/machine/DM/IDM setup and introduction新装片工艺/设备/直接物料/非直接物料的建立和引进
4.Investigate, analyze, report, and follow up quality cases调查、分析、报告和跟进质量问题事件
5.PFMEA, Control Plan, SOP, WI, OCAP generation and update PFMEA，控制计划，SOP, WI, OCAP的生成和更新
6.Other tasks assigned by manager and supervisor完成经理和主管安排的其他任务
岗位要求：
1. Bachelor’s degree or above本科及以上学历
2. 5 years or above semiconductor backend process related working experience 5年及以上半导体后端工艺相关工作经验
3. Major in electronics or materials science or physics 电子、材料科学或物理专业
4. Familiar with backend processes, Casting & Layer Transfer etc.
熟悉后道封装工艺， Casting & Layer Transfer 等。
5. Familiar with the FMEA / CP/OCAP/SPC tools熟悉FMEA / CP/OCAP/SPC工具
6. Good team and project player, lean 6 sigma green/yellow belt project experience is preferred 良好的团队和项目参与能力，有精益6西格玛绿/黄带项目经验者优先
7. Good skill on writing & Speaking English, office software and reporting良好的英语听说读写能力，办公软件和报告能力
8. Good skill on communication in internal & external team良好的内部和外部团队沟通能力