Job Description

Be responsible for flash memory test program development, unit failure analysis and device issue debug.
Be responsible for NAND Product and Package Qualification/Reliability tests setup/eFA/Action Plan.
Provide correct test condition for memory product and generate defined test flow for volume testing needs.
Product Evaluation DOE for Reliability/DPPM improvement, wafer test and unit test yield improvement.
Run test time analysis to get lowest cost test method in order to reach short test time and high test coverage.
Define/improve testing method to deal with new product introduced to mass production and marketing.
Deliver a world class throughput time on the testing code development to reach the most effective way of sample delivery TPT (Throughput Time).
Work with multinational team to complete projects in PDT (product development team) required time.

Qualifications

Electrical/Electronic/Computer/Material Engineering background with MS degree.
Coding experience with one or some of C/C++/Java/Perl/Python.
Ability to troubleshoot, analyze complex problems, multi-task and meet deadline.
Excellent English communication (written and verbal).
Good teamwork, willing to learn, logical thinking.
Excellent communication and interpersonal skills.