Job Description
In your new role you will:
-Responsible for package development tasks in OSAT: package definition, technology integration and project
management.
-Responsible for new process development and new product introduction in OSAT. Perform technical ramp
up management for seamless transition during new product / package ramp up phases into serial production.
-Responsible for enabling of new package platform and derivatives packages, and support of technology and
package development at OSAT. This includes new subcon enabling support role.
-Responsible for OSAT change management projects (major changes) ensuring projects are executed fulfilling
project requirements.
-Identify package level opportunities for cost down and executes cost down projects
-Responsible for package platform assessment between subcons and provides mapping to in-house capability
supported by the segments and package platform managers.
-Co-ordination/support alignment of Subcon Technology roadmaps with Segments and PTI. Manages subcon
technical days with subcon partners
职位要求：
Your Profile
You are best equipped for this task if you have:
-Masters/Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical), Physics, Chemistry
-Min. 8 years hands-on experience in managing subcons (assembly/ process engineering) with 5 years in project
management
-Good experience of FAR, 8D, audit skills, project systematics
-Working in a cross functional team comprising different cultural background
-Good communication and presentation skills
-Able to travel on short notice to support critical topics in assembly engineering